Aquos Pad (SH-08E) Dump File Dead Boot Repair 100% Tested File Download

Brand: Aqous

Name: Pad 7"

Model: SH08E

CPU Type: Qualcomm

Android: 4.2

File Type: EXT_CSD, Userarea, Boot1, Boot2

File Price: 3$

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Dump File Read info


Connection status: EHCI:HUB:HUB[#5]:USB 2.00 High-Speed

Interface: UFI High-Speed

Serial number: 0011-8840-9681

 Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)

Insertion test... Done

Init bus...

VCC: 3.3 V, VCCQ: 3.0 V

Bus: 8 bit (HS SDR 48MHz)

Access mode: sector mode

Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)

 Card/BGA: BGA (Discrete embedded) - High density MMC

 Manufacturer ID: 0x15 (Samsung)

 Product name: MBG4GC (0x4d4247344743), rev: 0x01, serial number: 0x8868C06B

 Manufacturing date: Feb 2014

CID: 1501004D 42473447 43018868 C06B21DC

CSD: D0270132 0F5903FF F6DBFFEF 8E40400C

EXT_CSD revision: 1.6 (MMC v4.5, v4.51) 

Partition info:

 Boot1: 4 MiB

 Boot2: 4 MiB

 RPMB: 4 MiB [Authentication Key not yet programmed]

 User area: 29.12 GiB(31,268,536,320 bytes)


Reading extcsd, size: 512 bytes...

File saved to "\\%BACKUPS%\DOCOMO\SH-08E(01.00.08-4.2.2-S5270)[KLMBG4GEAC-B001_8868C06B]\ext_csd.bin" (CRC32: 0xBB9B8A69) 

Current partition access: 

 Access to boot partition 1

Reading boot1, size: 4 MiB... Done in 0.225 s

File saved to "\\%BACKUPS%\DOCOMO\SH-08E(01.00.08-4.2.2-S5270)[KLMBG4GEAC-B001_8868C06B]\boot1.bin" (CRC32: 0x1147406A) 

 Blank checking: blank

Current partition access: 

 Access to boot partition 2

Reading boot2, size: 4 MiB... Done in 0.222 s

File saved to "\\%BACKUPS%\DOCOMO\SH-08E(01.00.08-4.2.2-S5270)[KLMBG4GEAC-B001_8868C06B]\boot2.bin" (CRC32: 0x1147406A) 

 Blank checking: blank

Current partition access: 

 Access to user area

Reading userarea, size: 64 MiB...  Done in 5.832 s

File saved to "\\%BACKUPS%\DOCOMO\SH-08E(01.00.08-4.2.2-S5270)[KLMBG4GEAC-B001_8868C06B]\userarea_64MiB.bin" (CRC32: 0x8A9EBC7F) 

 Blank checking: NOT blank






Aquos Pad (SH-08E) info


Connection status: EHCI:HUB:HUB[#5]:USB 2.00 High-Speed

Interface: UFI High-Speed

Serial number: 0011-8840-9681

 Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)

Insertion test... Done

Init bus...

VCC: 3.3 V, VCCQ: 3.0 V

Bus: 1 bit (SDR 48MHz)

Access mode: sector mode

Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)

 Card/BGA: BGA (Discrete embedded) - High density MMC

 Manufacturer ID: 0x15 (Samsung)

 Product name: MBG4GC (0x4d4247344743), rev: 0x01, serial number: 0x8868C06B

 Manufacturing date: Feb 2014

CID: 1501004D 42473447 43018868 C06B21DC

CSD: D0270132 0F5903FF F6DBFFEF 8E40400C

EXT_CSD revision: 1.6 (MMC v4.5, v4.51) 

Partition info:

 Boot1: 4 MiB

 Boot2: 4 MiB

 RPMB: 4 MiB [Authentication Key not yet programmed]

 User area: 29.12 GiB(31,268,536,320 bytes)

Cache size: 64 MiB

Hardware reset function: 1

Partition configuration: 0x38

 No boot acknowledge is sent (default)

 User area is enabled for boot

Partitioning support: 0x07

 Device support partitioning feature

 Device can have enhanced technological features

 Device partitioning possible

Boot configuration protection: 0x00

Boot bus conditions: 0x00

Boot area write protection: 0x00


ANDROID System Info:

 platform: msm8960, cpu abi: armeabi-v7a

 manufacturer: SHARP

 board: SH-08E, name: SH-08E

 brand: DOCOMO, model: SH-08E

 build model list: SH-08E

 build id: S5270, version: 4.2.2 [Jelly Bean] (01.00.08)

 build description: SH-08E-user 4.2.2 S5270 01.00.08 release-keys


Internal storage: 5.86 GiB

crypto state: unencrypted

Selected: [Samsung] KLMBG4GEAC-B001/32 GB rev 1.7/32G   (BGA153)

Flash File Download Link

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