Brand: Huawei
Name: Y7 Prime 2018
Model: LDN-L21
CPU Type: Qualcomm
Android: 8.0 (Oreo)
File Type: EXT_CSD, Userarea, Boot1, Boot2
File Price: 5$
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Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-9681
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x93E2F2A3
Manufacturing date: Feb 2018
CID: 15010047 4436424D 420193E2 F2A32550
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Reading extcsd, size: 512 bytes...
File saved to "\\%BACKUPS%\Android\(System_8.0.0.073(091T)-8.0.0-OPR6.170623.013)[GD6BMB_93E2F2A3]\ext_csd.bin" (CRC32: 0xBE805096)
Current partition access:
Access to boot partition 1
Reading boot1, size: 4 MiB... Done in 0.262 s
File saved to "\\%BACKUPS%\Android\(System_8.0.0.073(091T)-8.0.0-OPR6.170623.013)[GD6BMB_93E2F2A3]\boot1.bin" (CRC32: 0x1147406A)
Blank checking: NOT blank
Current partition access:
Access to boot partition 2
Reading boot2, size: 4 MiB... Done in 0.259 s
File saved to "\\%BACKUPS%\Android\(System_8.0.0.073(091T)-8.0.0-OPR6.170623.013)[GD6BMB_93E2F2A3]\boot2.bin" (CRC32: 0x1147406A)
Blank checking: NOT blank
Current partition access:
Access to user area
Reading userarea, size: 4.31 GiB... Done in 18.964 s
File saved to "\\%BACKUPS%\Android\(System_8.0.0.073(091T)-8.0.0-OPR6.170623.013)[GD6BMB_93E2F2A3]\userarea_4.31GiB.bin"
Blank checking: NOT blank
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